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1/23 MSM9836-XXX ? semiconductor general description the msm9836 is a pcm voice synthesis ic with built-in 3-mbit mask rom, d/a converter, and low-pass filter (lpf). the msm9836 is specifically designed for applications that use a microcontroller. for this reason, functional support for standalone mode and rc oscillation has been omitted from the msm9805, and the rom capacity and the number of phrases have been increased. by using oki's sound analysis and editing tool, rom data such as phrase control table can be easily set, created, edited, and evaluated. the following table lists the functional differences between the msm9836 and the msm9805. ? semiconductor MSM9836-XXX voice synthesis ic with built-in mask rom features ? 8-bit oki nonlinear pcm method/8-bit straight pcm method ? sampling frequency : 4.0 khz/5.3 khz/6.4 khz/8.0 khz/10.6 khz/12.8 khz/ (can be set for each phrase) 16.0 khz ? rom capacity : 3 mbits ? maximum playback time : 97.7 sec (f sam = 4.0 khz) 73.7 sec (f sam = 5.3 khz) 61.0 sec (f sam = 6.4 khz) 48.8 sec (f sam = 8.0 khz) ? master clock frequency : 4.096 mhz (ceramic oscillation/external clock input) ? edit rom function ? maximum number of phrases : 127 ? built-in current mode 10-bit d/a converter ? built-in low-pass filter ? power supply voltage : +2.0 to +5.5 v ? package : 24-pin plastic sop (sop24-p-430-1.27-k) (product name: MSM9836-XXXgs-k) xxx indicates code number. chip e2d0082-29-93 msm9836 3 mbits microcontroller ceramic nar/ busy simultaneous output 127 msm9805 2 mbits microcontroller/standalone ceramic/rc only nar output when operating in microcontroller interface mode 63 rom capacity interface oscillation status signal maximum number of phrases this version: sep. 1999 previous version: may. 1997
2/23 MSM9836-XXX ? semiconductor block diagram 3-mbit rom (including 17 kbits of edit rom & address rom) 19-bit multiplexer address controller 7 pcm synthesizer 10 8 10-bit dac & lpf aout data controller 19-bit address counter timing controller gnd v dd reset i/o interface crystal circuit extck i5 i4 i3 i2 i1 i0 st nar xt xt test v ref i6 busy
3/23 MSM9836-XXX ? semiconductor pin configuration (top view) nc : no connection 24-pin plastic sop 1 2 3 4 5 6 7 8 9 24 23 22 21 20 19 18 17 16 v dd xt xt nc test busy st nc aout v ref gnd nc nar nc reset nc 10 11 12 15 14 13 i0 i1 i2 i5 i4 i3 extck i6
4/23 MSM9836-XXX ? semiconductor pin descriptions symbol type description the ic enters the standby state if this pin is set to "l" level. at this time, oscillation stops and aout output becomes gnd level, then the ic returns to the initial state. apply a "l" pulse upon power-on. this pin has an internal pull-up resistor. reset i signal output pin that indicates whether the 7-bit latch (see block diagram) is idle. nar at "h" level indicates that the latch is empty and st input is enabled. nar o ceramic oscillator input/external clock input switching pin. set to "h" level if ceramic oscillation is used. set to "l" level if external clock is used. extck i volume setting pin. if this pin is set to gnd level, the maximum current is forced in, and if set to v dd level, the minimum current is forced in. an approx. 10 k w pull-down resistor is internally connected to this pin during operation. v ref i voice output pin. the voice signals are output as current changes. a "l" level signal is output through this pin in standby state. aout o ground pin. gnd power supply pin. insert a bypass capacitor of 0.1 m f or more between this pin and the gnd pin. v dd ceramic oscillator connection pin when ceramic oscillation is selected. input from this pin if external clock is used. xt i ceramic oscillator connection pin when ceramic oscillation is selected. leave this pin open if external clock is used. a "l" level signal is output through this pin in standby state. xt o normally leave this pin open. this pin is used only for testing the internal circuit. test i voice synthesis starts at fall of st , and addresses i0 to i6 are fetched at rise of st . input st when nar, the status signal, is at "h" level. this pin has internal pull-up resistor. st i phrase input pins corresponding to playback sound. i0 - i6 i pin 17 20 7 23 24 22 1 2 3 5 8 10-15, 18 this pin is at "h" level after reset is input. a "l" level signal is output through this pin for the time during which voice is being played. busy o 6
5/23 MSM9836-XXX ? semiconductor parameter symbol condition unit "h" input voltage v ih v v il v typ. (v dd =5.0 v, gnd=0 v, ta=C40 to +85c, unless otherwise specified) "l" input voltage min. max. 0.4 10 "h" input current 1 i ih1 a v ih =v dd 4.6 0.8 4.2 v oh v "h" output voltage i oh =C1 ma v ol v "l" output voltage i ol =2 ma C10 "l" input current 1 i il1 a v il =gnd C90 C200 C30 "l" input current 2 (*1) i il2 a internal pull-up resistor 0.4 1 dynamic supply current 1 (*2) i dd1 ma v ref =v dd , aout voltage=0v 10 standby current i ds a ta=C40 to +70c 10 713 v ref pin pull-down resistance r vref k w 50a ta=C40 to +85c 9.5 615 aout output current i aout ma at maximum output current v ref =v dd , aout voltage=0v 15 "h" input current 2 i ih2 a applies to xt pin only. v ih =v dd 16 dynamic supply current 2 (*3) i dd2 ma at maximum output current v ref =gnd, aout voltage=0v absolute maximum ratings recommended operating conditions electrical characteristics dc characteristics (1) parameter symbol condition rating unit power supply voltage input voltage v dd ta=25c C0.3 to +7.0 v storage temperature v in C0.3 to v dd + 0.3 v t stg C55 to +150 c (gnd=0v) parameter symbol condition range unit power supply voltage v dd 2.0 to 5.5 v original oscillation frequency t op C40 to +85 c f osc typ. mhz when crystal is selected (gnd=0 v) operating temperature min. max. 4.096 3.5 4.5 *1 applicable to reset , st *2 dynamic supply current excluding dac output current *3 dynamic supply current at maximum output current
6/23 MSM9836-XXX ? semiconductor dc characteristics (2) *1 applicable to reset , st *2 dynamic supply current excluding dac output current *3 dynamic supply current at maximum output current parameter symbol condition unit "h" input voltage v ih v v il v typ. (v dd =3.1 v, gnd=0 v, ta=C40 to +85c, unless otherwise specified) "l" input voltage min. max. 0.4 10 "h" input current 1 i ih1 a v ih =v dd 2.6 0.5 2.7 v oh v "h" output voltage i oh =C1 ma v ol v "l" output voltage i ol =2 ma C10 "l" input current 1 i il1 a v il =gnd C30 C100 C10 "l" input current 2 (*1) i il2 a internal pull-up resistor 0.15 0.5 dynamic supply current 1 (*2) i dd1 ma v ref =v dd , aout voltage=0v 5 standby current i ds a ta=C40 to +70c 10 713 v ref pin pull-down resistance r vref k w 20a ta=C40 to +85c 3.2 1.4 5 aout output current i aout ma at maximum output current v ref =v dd , aout voltage=0v 15 "h" input current 2 i ih2 a applies to xt pin only. v ih =v dd 5.5 dynamic supply current 2 (*3) i dd2 ma at maximum output current v ref =gnd, aout voltage=0v
7/23 MSM9836-XXX ? semiconductor ac characteristics parameter symbol condition unit master clock duty cycle f duty 50% t w( rst ) s typ. (v dd =5.0 v, gnd=0 v, f osc =4.096 mhz, ta=C40 to +85c) reset input pulse width min. max. 0.35 2000 1 data setup time t dw s 0 10 40 60 t d( rst ) s reset input time after power-on t ( st ) s st input pulse width 10 nar output time 1 t sns s f sam =8 khz 375 350 400 nar output time 2 t naa s f sam =8 khz 440 315 500 nar output time 3 t nab s f sam =8 khz 375 350 500 nar output time 4 t nac s f sam =8 khz 64 60 68 d/a converter change time t dar , t daf ms 250 200 300 standby transition time (at end of voice output) t stb ms 1 data hold time t wd s t ss s the st - st pulse interval upon entering the stop code (*4) t stp s st signal setup time at power-on 375 350 500 silence time between phrases t bln s f sam =8 khz 40 1 10 busy output time 1 t sbs s f sam =8 khz 375 350 400 busy output time 2 t bsya s f sam =8 khz (*4) (*4) (*4) (*4) (*4) (*4) (*4) *4 proportional to master the periods of oscillation frequency f osc1 and f osc2 . the rated values show values when the standard master oscillation frequency is used.
8/23 MSM9836-XXX ? semiconductor timing diagrams 1. ac characteristics at power-on v dd reset (i) st (i) nar (o) busy (o) v dd min t d( rst ) t w( rst ) t stp 2. ac characteristics in standby status and when the ic is activated aout (o) t dar t stb standby transtion time t daf nar (o) st ( i ) t ( st ) i6 to i0 (i) t dw t wd voice playback t sns t naa d/a converter chan g e time oscillation start busy (o) t sbs t bsya
9/23 MSM9836-XXX ? semiconductor 3. playback timing aout (o) t dar nar (o) st ( i ) i6 to i0 (i) t nab 1st phrase address 2nd phrase address 3rd phrase address 1st phrase playback t nac oscillation start t bln busy (o) t bsya 2nd phrase playback 3rd phrase playback the pins i6 to i0 are used to enter the address of a phrase subject to voice synthesis. voice synthesis starts by entering the st signal during addressing.
10/23 MSM9836-XXX ? semiconductor 4. stop code input timing i6 to i0 (i) st ( i ) nar (o) aout (o) user phrase "0000000" voice stop t ss busy (o) when i6-i0 are set to "0000000" during voice playback (during the output of "l" level at the busy pin), and a st signal is input, playback stops regardless of whether nar is at "h" or "l" level and aout becomes 1/2 i aout . stop code becomes valid at the falling edge of st . the stop code does not initialize internal units but only stops playback. to initialize an internal register, use the reset pin.
11/23 MSM9836-XXX ? semiconductor 1. sampling frequency as shown in table 1.1, 7 sampling frequencies are available. a sampling frequency can be selected and assigned to each phrase in rom data. table 1.1 sampling frequency 2. recording/playback time figure 2.1 below shows memory allocation of the on-chip mask rom. about 17 kbits of data area is allocated for the phrase control table, phrase data control and test data. therefore, actual data area for storing sound data equals the total mask rom capacity minus 17 kbits. 16.0 khz f osc1 /256 12.8 khz f osc1 /320 10.6 khz f osc1 /384 8.0 khz f osc1 /512 6.4 khz f osc1 /640 5.3 khz f osc1 /768 4.0 khz f osc1 /1024 sampling frequency at standard oscillation frequency frequency diving ratio figure 2.1 memory allocation of on-chip mask rom phrase control table area pharase data control area test data area user's area 8k bit 8k bit 1k bit 3055k bit on-chip mask rom capacity 3072k bit
12/23 MSM9836-XXX ? semiconductor 3. playback method this ic provides two kinds of playback methods, non-linear pcm algorithm and straight pcm algorithm. when the 8-bit non-linear pcm algorithm is selected, sound quality can be improved because a resolution equivalent to 10-bit straight pcm is available around the waveform center. you can select either non-linear pcm algorithm or straight pcm algorithm for each phrase. table 3.1 shows the relationship between playback methods and applicable sounds. it is recom- mended to evaluate the sound quality before actual use. table 3.1 relationship between playback methods and applicable sounds the playback time is obtained by dividing the memory capacity by the bit rate. the playback time for 8-bit pcm algorithm is obrained by using the following equation. memory capacity [bit] bit rate [bps] memory capacity [bit] sampling frequency [hz] 8 [bit] playback time [sec] = = (3072C17) 1024 [bit] 8000 [hz] 8 [bit] playback time = = 48.8 [sec] for example, if all phrases are stored in the msm9836 at 8 khz sampling frequency, the maximum playback time is as follows. table 2.1 maximum playback time playback method applicable sound 8-bit non-linear pcm algorithm human voice 8-bit straight pcm algorithm beep tone, sound effects f sam =16.0khz 24.4 f sam =8.0khz 48.8 f sam =6.4khz 61.0 f sam =4.0khz 97.7 user's area 3055k bit rom capacity 3m bit maximum playback time (sec) model msm9836
13/23 MSM9836-XXX ? semiconductor 4. phrase control table because the lsi contains the phrase control table, it is possible to play back multiple phrases in succession by a single easy control operation like controlling a single regular phrase playback. up to 8 combined phrases including a silence can be registered in a single address in the phrase control table. further, you can use the maximum memory space for data storage because it is not required to have the same phrase data. to show an example, let's assume that your application needs to speak two similar sentences, "it is fine today" and "it is rainy today." the two sentences have the common words "it", "is" and "today". what you have to do is to prepare these common sound data, not in sentences but in words, and to store each combined phrase data in phrase control table as shown in table 4.1 and figure 4.1 multiple phrases can be played continuously merely by specifying a desired phrase using an x address. for an example from table 4.1, when address "01" is specified, "it is fine today" is played, and when address"02" is specified, "it is rainy" is played. phrase control table, a silence can be inserted without using the user's area. minimum time for silence 32 ms maximum time for silence 4064 ms time unit for setting up silence 32 ms table 4.1 matrix of the phrase control table no. x-address (hex) y-address (up to 8 phrases) sound data 101 202 303 126 7e 127 7f [10] silence [02] [01] [03] [12] silence [02] [01] [03] [21] [10] [02] [01] [11] [12] [22] [03] it is (silence) fine today. it is (silence) rainy today. it is fine becoming cloudy, rainy in some areas today.
14/23 MSM9836-XXX ? semiconductor figure 4.1 phrase combination matrix for phrase control table no. y-address phrase 101 202 303 16 10 17 11 18 12 19 13 32 20 33 21 34 22 127 7f phrase data registration area 1 [01] 2 [02] 3 silence (64ms) 4 [12] 5 [03] 6 7 8 phrase control table area phrase addigned 0 silence time 1 32 ms 2 64 ms 127 4064 ms silence time setting (32ms n) no. x-address 101 202 303 404 505 606 707 808 909 127 7f it is today fine cloudy rainy snowy occasionally becoming in some areas it is rainy today
15/23 MSM9836-XXX ? semiconductor 5. oscillation and clock input 5. 1 ceramic oscillation figure 2 shows an external circuit using a ceramic oscillator. figure 2 external circuit using a ceramic oscillator xt xt c1 c2 extck pull this pin to "h" level for example, the following table shows the optimum load capacitances, power supply voltage ranges, and operating temperature ranges when ceramic oscillators made by murata mfg co., ltd., and tdk co., ltd. are used. (note) when a 4 mhz ceramic oscillator is used, the playback speed of msm9802/03/05 is slower by 2 percent than that of an analysis tool or a demonstration board. maker frequency (mhz) csa4.09mgu type operating temperature range (c) supply voltage range (v) c1 (pf) c2 (pf) optimal load capacity ceramic oscillator 4.09 C40 to +85 2.0 to 5.5 cst4.09mgwu 4.09 2.0 to 5.5 ccr4.00mc3 4.0 C40 to +85 2.4 to 5.5 built in built in built in built in murata mfg. tdk 30 30
16/23 MSM9836-XXX ? semiconductor 5. 2 external clock input figure 3 shows a circuit for external clock input. xt xt extck pull this pin to "l" level open external oscillation circuit figure 3 circuit for external clock input
17/23 MSM9836-XXX ? semiconductor 6. low-pass filter in this ic, all voice outputs are through the built-in low-pass filter (lpf). figure 4 and table 4 show the lpf frequency characteristics and lpf cutoff frequency respectively. only the voice output through lpf is enabled in this ic. figure 4 lpf frequency characteristics (f sam =8 khz) table 4 lpf cutoff frequency 0 C20 C40 C60 [db] 100 1k 10k C10 10 C30 C50 C80 C70 20 [ hz ] 10 sampling frequency (khz) cutoff frequency (khz) (f sam ) (f cut ) 1.2 1.6 4.0 5.3 2.0 6.4 2.5 8.0 3.2 10.6 4.0 12.8 5.0 16.0
18/23 MSM9836-XXX ? semiconductor 7. standby transition when playback of a phrase is finished, if playback of the next phrase does not start up within t stb (0.25 sec. typ.), the ic enters standby status and the entire operation stops. i5-i0 st nar aout busy figure 5 voice playback timing during d/a converter change time if playback is attempted during d/a converter change time as shown in figure 5, the ic exits from standby status and the output from the d/a converter begins going to the 1/2 i aout level. when the output reaches 1/2 i aout , voice playback starts.
19/23 MSM9836-XXX ? semiconductor 8. voice output unit equivalent circuit (aout, f ref pins) figure 8.1 voice output unit equivalent circuit pcm value v dd current-sourcing type d/a converter aout standby signal 10k w (typ) v ref ( the above switch p ositions show those when the circuit is active. ) i aout
20/23 MSM9836-XXX ? semiconductor d/a converter output current characteristics power supply voltage vs. output current characteristics (ta=25 c, v aout =0v) 14 12 10 8 6 4 2 0 0123456 aout output current [ma] power suppl y voltage [ v ] temperature vs. output current characteristics (v dd =5v, v aout =0v) 14 12 10 8 6 4 2 0 C50 C25 0 25 50 75 100 aout output current [ma] ambient temperature ta [ c ] v ref voltage vs. output current characteristics (ta=25 c, v dd =5v, v aout =0v) 10 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 v ref [v] aout output current [ma]
21/23 MSM9836-XXX ? semiconductor application circuit gnd v dd i0 i5 i4 i3 i2 i1 v ref i6 st reset busy nar test xt xt extck aout ain vr stby gnd sel v cc sp sp MSM9836-XXX msc1157 (speaker drive amplifier) + - + - mcu
22/23 MSM9836-XXX ? semiconductor pad configuration pad layout chip size x=7.65mm y=3.32mm chip thickness 350 m m 30 m m pad size 110 m m 110 m m substrate potential gnd chip and pad number y-axis x-axis 13 12 11 10 9 8 7 6 5 4 3 2 1 19 18 17 16 15 msm9836 14 (nc) pad coordinates (chip center is located at x=0 and y=0) pad no. pad name x-axis y-axis pad no. pad name x-axis y-axis 1v dd C3620 C452 11 i3 3673 415 2 xt C3623 C742 12 i4 3673 816 3 xt C3623 C1349 13 i5 3673 1460 4 test C1932 C1460 14 reset 1778 1460 5 busy C1044 C1455 15 i6 1260 1458 6 extck 1163 C1453 16 nar C2443 1460 7 st 2234 C1455 17 gnd C3665 1460 8 i0 3673 C1432 18 v ref C3623 1136 9 i1 3673 C754 19 aout C3623 585 (unit: m m) 10 i2 3673 C312
23/23 MSM9836-XXX ? semiconductor (unit : mm) package dimensions notes for mounting the surface mount type package the sop, qfp, tsop, tqfp, lqfp, soj, qfj (plcc), shp, and bga are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact okis responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). sop24-p-430-1.27-k package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 0.58 typ. mirror finish
notice 1. the information contained herein can change without notice owing to product and/or technical improvements. before using the product, please make sure that the information being referred to is up-to-date. 2. the outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. when planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. when designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. neither indemnity against nor license of a third partys industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. no responsibility is assumed by us for any infringement of a third partys right which may result from the use thereof. 6. the products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). these products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. certain products in this document may need government approval before they can be exported to particular countries. the purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. no part of the contents contained herein may be reprinted or reproduced without our prior permission. 9. ms-dos is a registered trademark of microsoft corporation. copyright 1999 oki electric industry co., ltd. printed in japan e2y0002-29-62

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